On September 22, a groundbreaking ceremony was held for an advanced packaging industrial park at the Baipu Industrial Park in Kaohsiung, Taiwan. TSMC will establish facilities there for advanced packaging technology validation and industry talent training.

Kaohsiung Deputy Mayor Lo Ta-sheng said TSMC will build two buildings: one for a technology validation lab and one for a talent training center. The full facility is expected to begin operation in Q4 2029.

Officials noted that rapid growth in AI and high-performance computing has made advanced packaging a core battleground in the global semiconductor industry. The park aims to attract upstream equipment and materials suppliers to conduct nearby R&D, testing, and technology validation, shortening the path from development to mass production and helping local firms join the advanced chip supply chain.

ICgoodFind: Kaohsiung’s advanced packaging park has broken ground, with TSMC adding validation labs and a talent base. The AI chip advanced packaging supply chain continues to expand.